Thermal stability of novel polyurethane adhesives investigated by TGA

Authors

  • Mariusz Maminski Warsaw University of Life Sciences - SGGW, Faculty of Wood Technology159 Nowoursynowska St., 02-776 Warsaw, Poland.
  • Waldemar Jaskolowski Warsaw University of Life Sciences - SGGW, Faculty of Wood Technology159 Nowoursynowska St., 02-776 Warsaw, Poland.
  • Pawel Parzuchowski The Main School of Fire Service, 52/54 SÅ‚owackiego St., 01- 629 Warsaw, Poland.

DOI:

https://doi.org/10.13171/mjc.3.3.2014.17.05.13

Abstract

The objective of the work was an assessment of thermal stability of novel polyurethane wood adhesives by means of TGA. Hyperbranched polyglycerols of various structures were used as polyol components cured with polymeric methylenediphenyldiisocyanate (PMDI) or polymeric hexamethylenediisocyanate (PHDI). Resultant adhesives were thermally degraded in temperature range 20 - 500ºC. Performance of polyurethane based on fully aliphatic polyglycerol was inferior to those based on polyglycerols bearing aromatic moieties. The differences in 50%-weight loss temperature achieving 27 - 39°C as well as residual weights at 480 ºC indicate the contribution of aromatic units presence within the macromonomer structure to increased thermal stability of polyurethane upon thermal degradation. Furthermore, temperature of 50% weight loss revealed that thermal stability of the developed hyperbranched polyglycerol-based adhesives was comparable to that of the commercial PUR adhesive.

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Published

2014-05-17

Issue

Vol. 3 No. 3 (2014)

Section

Polymer Chemistry

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