Electroless deposition of Ni-P on a silicon surface
DOI:
https://doi.org/10.13171/mjc64/01705311536-cherkaouiAbstract
The present article concerns the metallization of silicon substrates by deposition of the nickelphosphorus alloy produced by an autocatalytic chemical process. The deposition electrolyte is composed of a metal salt, a reducing agent (sodium hypophosphite), a complexing agent (sodium citrate) and a buffer (ammonium acetate). The deposition could only be carried out after activation of the silicon by fixing catalytic species on its surface. The immersion of the silicon samples in palladium chloride made it possible to produce relatively thick and regular Ni-P coatings. The immersion time was optimized. The activation of Si was characterized by XPS and the Ni-P coating by XPS and SEM. The electrochemical study did not show any real mechanism changes compared to the Ni-P deposition on a conductive surface.References
- M. Jack Walker Ed. by Marcel Decker, Handbook of Manufacturing Engineering, Inc., Cleveland, U.S.A, 1996, pp 889-891.
- M.-H. Kiang, M. A. Lieberman, N. W. Cheung, and X. Y. Qian, Pd/Si plasma immersion ion implantation for selective electroless copper plating on SiO, Appl. Phys. Lett. 1992, 60, 46, 2767-2769
- H. S. Cole, Y. S. Liu, J. W. Rose, and R. Guida, Laser-induced selective copper deposition on polyimide. Appl. Phys. Lett. 1988, 53, 21, 2111-2113
- L.C. Kuo, Y.C. Huang, C.L. Lee, Y.W. Yen, The activation effect of Pd nanoparticles on electroless nickel-phosphorous deposition, Electrochim. Acta, 2006, 52, 353-360.
- H.B. Liu, J. Li, L.J. Wang, Electroless nickel plating on APTHS modified wood veneer for EMI shelding, Appl. Surf. Sci., 2010, 257, 1325-1332.
- D. Song, J.D. Zhou, W. Jiang, X.J. Zhang, Y. Yan, F.S. Li, A novel activation for electroless plating on preparing Ni/PS microspheres, Mater. Lett., 2009, 63, 282-288.
- J.H. Byeon, K.Y. Yoon, Y.K. Jung, J. Hwang, Thermophoretic deposition of palladium aerosol nanoparticles for electroless micropatterning of copper, Electrochem. Commun., 2008, 10, 1272-1275
- J. Flis, D.J. Duquette, Initiation of Electroless Nickel Plating on Copper, Palladium-Activated Copper, Gold, and Platinum, J. Electrochem. Soc., 1984, 131, 254-260
- M.-H. Kiang, M. A. Lieberman, N. W. Cheung, and X. Y. Qian, Pd/si plasma immersion ion implantation for selective electroless copper plating on SiO, Appl. Phys. Lett., 1992, 60, 22, 2767-2769.
- Dong Tian, De Y. Li, Fang F. Wang, Ning Xiao, Rui Q. Liu, Ning Li, Qing Li, Wei Gao, Gang Wu, A Pd-free activation method for electroless nickel deposition on copper, Surf. & Coatings Tech. 2013, 228, 27-33
- M. Cherkaoui, E. Chassaing, Interfinish. 1992, 92, 127-133.
- E. Chassaing, M. Cherkaoui, A. Srhiri, Electrochemical investigation of the autocatalytic deposition of Ni-Cu-P alloys, J. Appl. Electrochem., 1993, 23, 1169-1174.
- M. Ebn Touhami, E. Chassaing, M. Cherkaoui, Modelisation of Ni-P electroless deposition in ammoniacal solutions, Electrochem. Acta, 2003, 48, 3651-3658.
- A. Sharif, Y.C. Chan, M.N. Islam, M.J. Rizvi, Dissolution of electroless Ni metallization by lead-free solder alloys, J. Alloy Compd., 2005, 388, 75-82
- G.F. Cui, J. Zhao, S.F. Liu, G. Wu, Structural and Corrosion Properties of NiPx Metallic Glasses: Insights from EIS and DFTJ. Phys. Chem., C 2011, 115, 21169-21176.
- H. El Grini, A. Machrouhi, S. Cherrouf, M. Cherkaoui, Elaboration by electroless and characterization of Ni-Sn-P alloy, Der Pharma Chemica, 2014, 6, 6, 294-299.
- L. Lacourcelle, Les dépôts chimiques, Galvano Organo, 1977, 478, 789-795.
- F. A. El Hadj, A. Amiar, M. Cherkaoui, J.-N. Chazalviel, F. Ozanam, Study of organic grafting of the silicon surface from 4-nitrobenzene diazonium tetrafluoroborate, Electrochim., Acta 2012, 70, 318-324.
- Y.S. Kim and H.J. Sohn, Mathematical Modeling of Electroless Nickel Deposition at Steady State Using Rotating Disk Electrode, J. Electrochem. Soc., 1996, 143, 505-510.
- L.M. Abrantes, J.P. Correira, J. Electrochem. Soc., On the Mechanism of Electroless Niâ€P Plating 1994, 141, 2356-2362.
- I. Ohno, Electrochemistry of electroless plating, Mater. Sci. Eng., A 1991, 146, 33-40.
- P. Pouderoux, I. Chassaing, J.P. Bonino, A. Rousset, Plating of nickel-phosphorus multilayer alloys: current pulse effects on the microstructural and mechanical properties, Surf. Coat. Technol., 1991, 45, 161-170.
- L.M. Abrantes, A. Fundo, G. Jin, Influence of phosphorus content on the structure of nickel electroless deposits, J. Mater. Chem., 2001, 11, 200-203.
- C.C Hu, A. Bai, Mater. Influences of the phosphorus content on physicochemical properties of nickel-phosphorus deposits, Chem. Phys., 2002, 77, 215-225.
- M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, Pergamon Press, Oxford, 1996, pp 504-510.
- E. Chassaing, K.Vu Quang, R. Wiart, Kinetics of copper electrodeposition in citrate electrolytes 1986, 16, 591-604.
- A. Bouyanzer, B. Hammouti, L. Majidi, Pennyroyal oil from Mentha pulegium as corrosion inhibitor for steel in 1 M HCl, Mater. Lett., 2006, 60, 2840-2843.
- K.S. Cole, R.H. Cole, Dispersion and Absorption in Dielectrics, J. Chem. Phys., 1941, 9, 341-351.
- -K. Marušić, H. Otmačić Ćurković, H. Takenouti, Inhibiting effect of 4-methyl-1-p-tolylimidazole to the corrosion of bronze patinated in sulphate medium, Electrochim. Acta 2011, 56, 7491-7502.
- M. Ebn Touhami, M. Cherkaoui, A. Srhiri, A. Ben Bachir, E. Chassaing, Electrochemical investigation of Ni-P autocatalytic deposition in ammoniacal solutions, J. Appl. Electrochem., 1996, 26, 487-491.
- Z. Xie, G. Yu, B. Hu, X. Zhang, L. Li, W. Wang, D. Zhang, Polarization Behavior of Electroless Ni-P Plating on Magnesium Alloys, Int. J. Electrochem. Sci., 2013, 8, 6664 - 6677.
Downloads
Published
Issue
Section
License
Authors who publish with this journal agree to the following terms:- Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal
- Authors are able to enter into separate, additional contractual arrangements for the non-exclusive distribution of the journal's published version of the work (e.g., post it to an institutional repository or publish it in a book), with an acknowledgement of its initial publication in this journal
- Authors are permitted and encouraged to post their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work (See The Effect of Open Access).
